"testing loranger test socket"
Testing 15mm X 15mm Process Loranger Test Socket Dynamic Static And Humidity Burn In Options
Upgrade Your Testing Process with Loranger Test Socket s Dynamic Static and Humidity Burn-in Options Design Features Loranger Standard and APS Contacts Availablefor Pad Pitches of0.22 mm and Greater Depth-Controlled Wiping Contact with Compliant Cover Accurate, Tightly-Controlled Package Fit Zero-Insertion-Force Open Top and Clam Shell Socket Designs Optional Case Contacts and Heat Sinks
Experience Superior Testing with Customizable Loranger Test Socket
003006002J6617 2 INPUT/OUTPUT (I/O) SURFACE MOUNT DEVICE (SMD) SOCKET SMD 2 0.350 mm 0.014 in 006008003J6617 3 Input/Output (I/O) Surface Mount Device (SMD) Socket SMD 3 0.350 mm 0.014 in 006008004J6617 2 INPUT/OUTPUT (I/O) SURFACE MOUNT DEVICE (SMD) SOCKET SMD 2 0.800 mm 0.031 in 006008006J6617 3 Input/Output (I/O) Surface Mount Device (SMD) Socket SMD 3 N/A 010005003J6617 3 Input/Output (I/O) Surface Mount Device (SMD) Socket SMD 3 N/A 010006004J6617 4 Input/Output (I/O)
Customizable Ceramic Loranger Test Socket For Test And Measurement Requirements
Customizable Loranger Test Socket for Burn-in Test and Measurement Requirements Product Features *Loranger manufactures more than 3,500 socket styles including CSPBGA,High-Power, LGA, SOlC, TO and over 1,300 QFN designs * Loranger SMTand PTH contacts are available for pitches of 0.22 mmand larger, and for contact pad/bump sizes of0.20mm and larger *Loranger socket features include: Open-Top, Clamshell, Kelvin, DoubleDuty Kelvin, 50 Ohm termination, Heat Sinks, Heaters, and
Low Insertion Force Loranger Test Socket
Testing Made Easy with Loranger Test Socket Featuring Low Insertion Force and Positive Contact Wiping Top Loading Designs High Side Contacts Help Align Package Leads Positive Contact Wiping Action Low Insertion Force Bottom Socket Standoffs Help Board Cleaning Various Sizes and I/O Unloading Tool Also Available 0297002997ASSYA 21 Input/Output (I/O) Dual Inline Package (DIP) Socket DIP 21 Multi 02758 141 6215 14 Input/Output (I/O) and 2.54 Millimeter (mm) Pitch Dual Inline
Resistance 1000 Megaohms Loranger Test Socket
Loranger Test Socket The Ultimate Solution for Testing Efficiency Insulation Resistance 1000 Megaohms Item # Item Name Package Name Number of Input/Output (I/O) Pitch Q0403 131 6218A 12 Input/Output (I/O) and 0.8 Millimeter (mm) Pitch Gull Wing Socket SOIC 12 0.8 mm0.0315 in Q0402 151 6218A 14 Input/Output (I/O) and 0.5 Millimeter (mm) Pitch Gull Wing Socket SOIC 14 0.50 mm0.02 in Q0402 171 X218A 16 Input/Output (I/O) and 0.5 Millimeter (mm) Pitch Gull Wing Socket SOIC 16 0
Wire-Formed Contacts and Solid Clamping for Loranger Test Socket Open Top and Clam Shell Designs
Open Top and Clam Shell Designs Accommodate Standard Carriers Rugged Construction Wire-Formed Contacts Solid Clamping of Device Carrier Various Sizes and I/O Available 223181334M6617 332 Input/Output (I/O) Flat Pack Socket Flat Pack 332 Multi 223181334M6618A 332 Input/Output (I/O) Flat Pack Socket Flat Pack 332 Multi 02900 441 6215 44 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Flat Pack Socket Flat Pack 44 1.27 mm 0.05 in 02900 501 6215 50 Input/Output (I/O) and 1.27
High-Performance Loranger Test Socket for In-line TO and SIP Packages
Kelvin and Non Kelvin Top Loading For In-line TO and SIP Packages Modified and Custom Sockets Available May Accommodate More than One Package Fit is Independent of Package Body L, W and H Various Pitches Available Item # Item Name Package Name Number of Input/Output (I/O) Pitch 02905 041 6215 4 Input/Output (I/O) and 2.54 Millimeter (mm) Pitch Single Inline Pin (SIP) Socket SIP 4 2.540 mm 0.100 in 02905 041 6225 4 Input/Output (I/O) and 2.54 Millimeter (mm) Pitch Single
15-Pin Versatile Loranger Test Socket
15-Pin Versatile Loranger Test Socket for Testing Different Types of Electronic Devices at 100V 0.22mm Pitch and Greater Accommodates Package Height Variations Non-Magnetic Socket Options Available Accurate, Tightly-controlled Package Fit Contacts Connect Land pad to Board Pad 013SQ 009J6617 9 Input/Output (I/O) and 0.4 Millimeter (mm) Pitch Land Grid Array (LGA) Socket LGA 9 0.40 mm0.0157 in 013SQ 009J6618A 9 Input/Output (I/O) and 0.4 Millimeter (mm) Pitch Land Grid Array
Loranger 006004006J6617 Test Socket 6 I/O and 0.23/0.22mm Pitch BGA/CSP Socket Life Cycle 000 cycles
0.22 mm Pitch and Greater Accommodates Package Height Variations Non-Magnetic Socket Options Available Accurate, Tightly-controlled Package Fit Contacts Connect Solder ball to Board Pad Optional Heat Sink Item # Item Name Package Name Number of Input/Output (I/O) Pitch 006004006J6617 6 Input/Output (I/O) and 0.23/0.22 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket BGA/CSP 6 Multi 0.22 mm 0.23 mm 007SQ 004J6617 4 Input/Output (I/O) and 0.40
Upgrade Your Testing Efficiency with BGA Test Socket Advanced and Durable Design
Specifications Minimum Order 1 Brands Loranger International Corp. Package Name DFN Number of Input/Output (I/O) 4 Pitch 1.1 mm 0.043 in Array 2 on 2 Kelvin Type false Socket Style Clamshell Mounting Through-Hole Lead Time 2 to 4 wee Internal Socket Area (Package Dimensions) Internal Socket Package Body Length (L) 2.5 mm Internal Socket Package Body Length (L) Tolerance 0.05 mm Internal Socket Package Body Width (W) 2.00 mm Internal Socket Package Body Width (W) Tolerance 0
