"test sockets"
15-Pin Versatile Loranger Test Socket
15-Pin Versatile Loranger Test Socket for Testing Different Types of Electronic Devices at 100V 0.22mm Pitch and Greater Accommodates Package Height Variations Non-Magnetic Socket Options Available Accurate, Tightly-controlled Package Fit Contacts Connect Land pad to Board Pad 013SQ 009J6617 9 Input/Output (I/O) and 0.4 Millimeter (mm) Pitch Land Grid Array (LGA) Socket LGA 9 0.40 mm0.0157 in 013SQ 009J6618A 9 Input/Output (I/O) and 0.4 Millimeter (mm) Pitch Land Grid Array
Resistance 1000 Megaohms Loranger Test Socket
Loranger Test Socket The Ultimate Solution for Testing Efficiency Insulation Resistance 1000 Megaohms Item # Item Name Package Name Number of Input/Output (I/O) Pitch Q0403 131 6218A 12 Input/Output (I/O) and 0.8 Millimeter (mm) Pitch Gull Wing Socket SOIC 12 0.8 mm0.0315 in Q0402 151 6218A 14 Input/Output (I/O) and 0.5 Millimeter (mm) Pitch Gull Wing Socket SOIC 14 0.50 mm0.02 in Q0402 171 X218A 16 Input/Output (I/O) and 0.5 Millimeter (mm) Pitch Gull Wing Socket SOIC 16 0
Experience Superior Testing with Customizable Loranger Test Socket
003006002J6617 2 INPUT/OUTPUT (I/O) SURFACE MOUNT DEVICE (SMD) SOCKET SMD 2 0.350 mm 0.014 in 006008003J6617 3 Input/Output (I/O) Surface Mount Device (SMD) Socket SMD 3 0.350 mm 0.014 in 006008004J6617 2 INPUT/OUTPUT (I/O) SURFACE MOUNT DEVICE (SMD) SOCKET SMD 2 0.800 mm 0.031 in 006008006J6617 3 Input/Output (I/O) Surface Mount Device (SMD) Socket SMD 3 N/A 010005003J6617 3 Input/Output (I/O) Surface Mount Device (SMD) Socket SMD 3 N/A 010006004J6617 4 Input/Output (I/O)
Loranger 006004006J6617 Test Socket 6 I/O and 0.23/0.22mm Pitch BGA/CSP Socket Life Cycle 000 cycles
0.22 mm Pitch and Greater Accommodates Package Height Variations Non-Magnetic Socket Options Available Accurate, Tightly-controlled Package Fit Contacts Connect Solder ball to Board Pad Optional Heat Sink Item # Item Name Package Name Number of Input/Output (I/O) Pitch 006004006J6617 6 Input/Output (I/O) and 0.23/0.22 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket BGA/CSP 6 Multi 0.22 mm 0.23 mm 007SQ 004J6617 4 Input/Output (I/O) and 0.40
Low Insertion Force Loranger Test Socket
Testing Made Easy with Loranger Test Socket Featuring Low Insertion Force and Positive Contact Wiping Top Loading Designs High Side Contacts Help Align Package Leads Positive Contact Wiping Action Low Insertion Force Bottom Socket Standoffs Help Board Cleaning Various Sizes and I/O Unloading Tool Also Available 0297002997ASSYA 21 Input/Output (I/O) Dual Inline Package (DIP) Socket DIP 21 Multi 02758 141 6215 14 Input/Output (I/O) and 2.54 Millimeter (mm) Pitch Dual Inline
Wire-Formed Contacts and Solid Clamping for Loranger Test Socket Open Top and Clam Shell Designs
Open Top and Clam Shell Designs Accommodate Standard Carriers Rugged Construction Wire-Formed Contacts Solid Clamping of Device Carrier Various Sizes and I/O Available 223181334M6617 332 Input/Output (I/O) Flat Pack Socket Flat Pack 332 Multi 223181334M6618A 332 Input/Output (I/O) Flat Pack Socket Flat Pack 332 Multi 02900 441 6215 44 Input/Output (I/O) and 1.27 Millimeter (mm) Pitch Flat Pack Socket Flat Pack 44 1.27 mm 0.05 in 02900 501 6215 50 Input/Output (I/O) and 1.27
High Reliability KR-B2 676-314 Test Socket IC Burning Socket Adapter Fixture Test Bench Aging Socket for Chip Reliability Custom CNC Parts
Product Description: Place of Origin Guangdong, China Brand Name Krunter Future Description IC Adapter Socket Package SOP Series Type Standard Operating Temperature -55-+150 Structure Flip Over Pitch 0.5, 0.635, 0.65, 0.8, 1.27 mm, etc Contact Type Weld Contact Method Needle (Punching) Socket Material PEI, PES Rated Voltage 24V Rated Current More than 5A (@150) Contact Resistance 50 milliohms 10mA 20mV (initial value) Insulation Resistance DC100V Over 1000 megaohms
Customizable BGA Test Socket Housing Machining Center Probe Test Socket for High-Frequency Devices
High-Frequency Center Probe Test Socket for Devices up to 27mm Square FEATURES Aries unique universal socketing system allows the socket to be easily configured for any package, on any pitch (or multiple pitch) from 0.2mm or greater, in any configuration, with little or no tooling charge or extra lead-time. For Test & Burn-In of CSP, BGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LGA, LCC, PLCC, TO and any SMT package style made. Also can be compatible
Customizable Ceramic Loranger Test Socket For Test And Measurement Requirements
Customizable Loranger Test Socket for Burn-in Test and Measurement Requirements Product Features *Loranger manufactures more than 3,500 socket styles including CSPBGA,High-Power, LGA, SOlC, TO and over 1,300 QFN designs * Loranger SMTand PTH contacts are available for pitches of 0.22 mmand larger, and for contact pad/bump sizes of0.20mm and larger *Loranger socket features include: Open-Top, Clamshell, Kelvin, DoubleDuty Kelvin, 50 Ohm termination, Heat Sinks, Heaters, and
Testing 15mm X 15mm Process Loranger Test Socket Dynamic Static And Humidity Burn In Options
Upgrade Your Testing Process with Loranger Test Socket s Dynamic Static and Humidity Burn-in Options Design Features Loranger Standard and APS Contacts Availablefor Pad Pitches of0.22 mm and Greater Depth-Controlled Wiping Contact with Compliant Cover Accurate, Tightly-Controlled Package Fit Zero-Insertion-Force Open Top and Clam Shell Socket Designs Optional Case Contacts and Heat Sinks
Accurate BGA Test Socket Housing Testing Electronic Components 5-Axis CNC Machining
BGA Test Socket for Accurate Testing of Advanced Electronic Components Product Description: The BGA Test Socket is a high-quality product designed for testing and burn-in applications, specifically tailored for Quad Flat Package (QFP) socket type. With a pin pitch of 0.8mm, this socket is compatible with various electronic components and offers reliable performance during testing procedures. Manufactured by Azimuth Electronics, a trusted name in the industry, this socket
Upgrade Your Testing Efficiency with BGA Test Socket Advanced and Durable Design
Specifications Minimum Order 1 Brands Loranger International Corp. Package Name DFN Number of Input/Output (I/O) 4 Pitch 1.1 mm 0.043 in Array 2 on 2 Kelvin Type false Socket Style Clamshell Mounting Through-Hole Lead Time 2 to 4 wee Internal Socket Area (Package Dimensions) Internal Socket Package Body Length (L) 2.5 mm Internal Socket Package Body Length (L) Tolerance 0.05 mm Internal Socket Package Body Width (W) 2.00 mm Internal Socket Package Body Width (W) Tolerance 0
