"bga csp test socket"

Loranger 006004006J6617 Test Socket 6 I/O and 0.23/0.22mm Pitch BGA/CSP Socket Life Cycle 000 cycles

0.22 mm Pitch and Greater Accommodates Package Height Variations Non-Magnetic Socket Options Available Accurate, Tightly-controlled Package Fit Contacts Connect Solder ball to Board Pad Optional Heat Sink Item # Item Name Package Name Number of Input/Output (I/O) Pitch 006004006J6617 6 Input/Output (I/O) and 0.23/0.22 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket BGA/CSP 6 Multi 0.22 mm 0.23 mm 007SQ 004J6617 4 Input/Output (I/O) and 0.40

Customizable BGA Test Socket Housing Machining Center Probe Test Socket for High-Frequency Devices

High-Frequency Center Probe Test Socket for Devices up to 27mm Square FEATURES Aries unique universal socketing system allows the socket to be easily configured for any package, on any pitch (or multiple pitch) from 0.2mm or greater, in any configuration, with little or no tooling charge or extra lead-time. For Test & Burn-In of CSP, BGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LGA, LCC, PLCC, TO and any SMT package style made. Also can be compatible

Upgrade Your Testing Efficiency with BGA Test Socket Advanced and Durable Design

Specifications Minimum Order 1 Brands Loranger International Corp. Package Name DFN Number of Input/Output (I/O) 4 Pitch 1.1 mm 0.043 in Array 2 on 2 Kelvin Type false Socket Style Clamshell Mounting Through-Hole Lead Time 2 to 4 wee Internal Socket Area (Package Dimensions) Internal Socket Package Body Length (L) 2.5 mm Internal Socket Package Body Length (L) Tolerance 0.05 mm Internal Socket Package Body Width (W) 2.00 mm Internal Socket Package Body Width (W) Tolerance 0