5 Results For

"accurate ball grid array socket"

Quality 50 x 50MM BGA Test Socket Housing KR-DS50-SP Ball Grid Array Socket Factory Custom High Precision CNC Machining Services Hardware Processing Metal Part Machining Service factory

50 x 50MM BGA Test Socket Housing KR-DS50-SP Ball Grid Array Socket Factory Custom High Precision CNC Machining Services Hardware Processing Metal Part Machining Service

1 tem Description Mode QTY Accuracy(mm) 1 Sink EDM M3OF(TAIWAN) 1 0.005~0.01 2 Sink EDM (Mitsubish) EA8M/EA8A 2 0.005 3 Sink EDM FORM S350 3 0.005 4 Sink EDM( CHARMILLES-Switzerland) PROBOFORM 35P 1 0.005 5 Sink EDM( CHARMILLES-Switzerland) PROBOFORM 350 SP 2 0.005 6 Sink EDM ( CHARMILLES-Agie ) FO 23 UP 1 0.005 7 Sink EDM( CHARMILLES-Switzerland) ROBOFIL 390 1 0.005 8 Sink EDM( CHARMILLES-Switzerland) PROBOFIL240 1 0.003 9 Numerically controlled wirecutting m/c DK7732(MADE

Accurate BGA Test Socket Housing Testing Electronic Components 5-Axis CNC Machining

BGA Test Socket for Accurate Testing of Advanced Electronic Components Product Description: The BGA Test Socket is a high-quality product designed for testing and burn-in applications, specifically tailored for Quad Flat Package (QFP) socket type. With a pin pitch of 0.8mm, this socket is compatible with various electronic components and offers reliable performance during testing procedures. Manufactured by Azimuth Electronics, a trusted name in the industry, this socket

Custom CNC Machined Test Socket for IC Chip Testing Mechanism BGA Test Socket Housing KR-2501-DK

KR-7660-SP BGA Test Socket Housing OEM Custom Precision CNC Machined Metal Fabrication Service 3/4/5 Axis

Loranger 006004006J6617 Test Socket 6 I/O and 0.23/0.22mm Pitch BGA/CSP Socket Life Cycle 000 cycles

0.22 mm Pitch and Greater Accommodates Package Height Variations Non-Magnetic Socket Options Available Accurate, Tightly-controlled Package Fit Contacts Connect Solder ball to Board Pad Optional Heat Sink Item # Item Name Package Name Number of Input/Output (I/O) Pitch 006004006J6617 6 Input/Output (I/O) and 0.23/0.22 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket BGA/CSP 6 Multi 0.22 mm 0.23 mm 007SQ 004J6617 4 Input/Output (I/O) and 0.40