From complex IC packaging to high-density circuits, our testing sockets offer 3000+ package compatibility, micron-level precision, and flexible customization. We empower semiconductor testing, burn-in validation, and signal measurement across industries, enhancing efficiency and product reliability.

Key Features

• Comprehensive Package Support: Compatible with CSP, BGA, QFN, SOP, and 1300+ QFN designs for diverse IC testing.

• Ultra-Fine Pitch Contacts: SMT/PTH solutions for 0.22mm pitch and 0.20mm pad size, ensuring stable high-density testing.

• End-to-End Testing Systems: Integrated burn-in (dynamic/static/humidity), signal generation PCBs, and measurement tools.

• Customization Flexibility:

  • Design-to-Spec: Provide chip drawings for ID/MD design and socket production.

  • Sample Replication: Precision duplication based on physical samples.

  • Custom Blueprints: Manufacture sockets per client design files.

• Versatile Configurations: Clamshell, Open-top, probe pin sockets for multi-scenario applications.

Ideal Applications

• Semiconductor Validation: Burn-in and functional testing for BGA, LGA, WLCSP packages.

• Consumer Electronics: Performance evaluation of SOT, TSOP components pre-mass production.

• Industrial Control: Reliability testing for high-power modules and specialty ICs.

• R&D Acceleration: Rapid prototyping sockets to shorten development timelines.

Anchored in technology, steered by demand—we deliver precision testing sockets for global innovation. Customize your solution today!