Custom Testing Socket Solutions: Precision Compatibility for Full-Cycle IC Validation
2025/05/14
From complex IC packaging to high-density circuits, our testing sockets offer 3000+ package compatibility, micron-level precision, and flexible customization. We empower semiconductor testing, burn-in validation, and signal measurement across industries, enhancing efficiency and product reliability.
Key Features
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Comprehensive Package Support: Compatible with CSP, BGA, QFN, SOP, and 1300+ QFN designs for diverse IC testing.
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Ultra-Fine Pitch Contacts: SMT/PTH solutions for 0.22mm pitch and 0.20mm pad size, ensuring stable high-density testing.
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End-to-End Testing Systems: Integrated burn-in (dynamic/static/humidity), signal generation PCBs, and measurement tools.
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Customization Flexibility:
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Design-to-Spec: Provide chip drawings for ID/MD design and socket production.
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Sample Replication: Precision duplication based on physical samples.
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Custom Blueprints: Manufacture sockets per client design files.
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Versatile Configurations: Clamshell, Open-top, probe pin sockets for multi-scenario applications.
Ideal Applications
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Semiconductor Validation: Burn-in and functional testing for BGA, LGA, WLCSP packages.
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Consumer Electronics: Performance evaluation of SOT, TSOP components pre-mass production.
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Industrial Control: Reliability testing for high-power modules and specialty ICs.
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R&D Acceleration: Rapid prototyping sockets to shorten development timelines.
Anchored in technology, steered by demand—we deliver precision testing sockets for global innovation. Customize your solution today!
