"ball grid array socket"
80 X 90MM BGA Test Socket Housing KR-8090-SP Ball Grid Array Socket OEM Parts CNC Machining Services
BGA TEST SOCKET HOUSING KR-8090-SP Material: Aluminum Alloy Surface Treatment: Anodizing Color: customized Tolerance: 0.03mm Support and Services: Our Product Technical Support team is dedicated to assisting you with any questions or issues you may have regarding the BGA TEST SOCKET HOUSING. We provide expert technical guidance to ensure you get the most out of your product. In addition, our services include product installation support, troubleshooting assistance, and
50 x 50MM BGA Test Socket Housing KR-DS50-SP Ball Grid Array Socket Factory Custom High Precision CNC Machining Services Hardware Processing Metal Part Machining Service
1 tem Description Mode QTY Accuracy(mm) 1 Sink EDM M3OF(TAIWAN) 1 0.005~0.01 2 Sink EDM (Mitsubish) EA8M/EA8A 2 0.005 3 Sink EDM FORM S350 3 0.005 4 Sink EDM( CHARMILLES-Switzerland) PROBOFORM 35P 1 0.005 5 Sink EDM( CHARMILLES-Switzerland) PROBOFORM 350 SP 2 0.005 6 Sink EDM ( CHARMILLES-Agie ) FO 23 UP 1 0.005 7 Sink EDM( CHARMILLES-Switzerland) ROBOFIL 390 1 0.005 8 Sink EDM( CHARMILLES-Switzerland) PROBOFIL240 1 0.003 9 Numerically controlled wirecutting m/c DK7732(MADE
63164-136T BGA Azimuth Carrier Test Socket Ball Grid Array Azimuth Socket With Electrical Contactor
Ball Grid Array (BGA) 63164-136T Take Your Business to the Next Level with Contactor and Durable Product Description: A contactor is an essential component in electrical systems that are used to control the flow of electricity. It is a type of contact exciter that acts as a contact-making device in various applications, providing a reliable and efficient way to manage electrical circuits. Contactors are commonly used in industrial, commercial, and residential settings to
Accurate BGA Test Socket Housing Testing Electronic Components 5-Axis CNC Machining
BGA Test Socket for Accurate Testing of Advanced Electronic Components Product Description: The BGA Test Socket is a high-quality product designed for testing and burn-in applications, specifically tailored for Quad Flat Package (QFP) socket type. With a pin pitch of 0.8mm, this socket is compatible with various electronic components and offers reliable performance during testing procedures. Manufactured by Azimuth Electronics, a trusted name in the industry, this socket
Customizable BGA Test Socket Housing Machining Center Probe Test Socket for High-Frequency Devices
High-Frequency Center Probe Test Socket for Devices up to 27mm Square FEATURES Aries unique universal socketing system allows the socket to be easily configured for any package, on any pitch (or multiple pitch) from 0.2mm or greater, in any configuration, with little or no tooling charge or extra lead-time. For Test & Burn-In of CSP, BGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LGA, LCC, PLCC, TO and any SMT package style made. Also can be compatible
High Reliability KR-B2 676-314 Test Socket IC Burning Socket Adapter Fixture Test Bench Aging Socket for Chip Reliability Custom CNC Parts
Product Description: Place of Origin Guangdong, China Brand Name Krunter Future Description IC Adapter Socket Package SOP Series Type Standard Operating Temperature -55-+150 Structure Flip Over Pitch 0.5, 0.635, 0.65, 0.8, 1.27 mm, etc Contact Type Weld Contact Method Needle (Punching) Socket Material PEI, PES Rated Voltage 24V Rated Current More than 5A (@150) Contact Resistance 50 milliohms 10mA 20mV (initial value) Insulation Resistance DC100V Over 1000 megaohms
Convenient Press Lock Mechanism in BGA Test Socket Housing for Easy and Secure Access
Product Description: The BGA Test Socket Housing is an essential component designed for BGA socket testing applications, providing a reliable and secure housing solution for testing BGA sockets. This product features a color combination of gray and blue, giving it a modern and professional appearance suitable for various testing environments. With dimensions of 26*35MM, the BGA Test Socket Housing is compact yet spacious enough to accommodate BGA sockets of different sizes,
42MM BGA Test Socket Housing KR-DS42-BN Test Socket Housing CNC Machining Precision Machinery Parts Custom
1 tem Description Mode QTY Accuracy(mm) 1 Sink EDM M3OF(TAIWAN) 1 0.005~0.01 2 Sink EDM (Mitsubish) EA8M/EA8A 2 0.005 3 Sink EDM FORM S350 3 0.005 4 Sink EDM( CHARMILLES-Switzerland) PROBOFORM 35P 1 0.005 5 Sink EDM( CHARMILLES-Switzerland) PROBOFORM 350 SP 2 0.005 6 Sink EDM ( CHARMILLES-Agie ) FO 23 UP 1 0.005 7 Sink EDM( CHARMILLES-Switzerland) ROBOFIL 390 1 0.005 8 Sink EDM( CHARMILLES-Switzerland) PROBOFIL240 1 0.003 9 Numerically controlled wirecutting m/c DK7732(MADE
Custom CNC Machined Test Socket for IC Chip Testing Mechanism BGA Test Socket Housing KR-2501-DK
1 tem Description Mode QTY Accuracy(mm) 1 Sink EDM M3OF(TAIWAN) 1 0.005~0.01 2 Sink EDM (Mitsubish) EA8M/EA8A 2 0.005 3 Sink EDM FORM S350 3 0.005 4 Sink EDM( CHARMILLES-Switzerland) PROBOFORM 35P 1 0.005 5 Sink EDM( CHARMILLES-Switzerland) PROBOFORM 350 SP 2 0.005 6 Sink EDM ( CHARMILLES-Agie ) FO 23 UP 1 0.005 7 Sink EDM( CHARMILLES-Switzerland) ROBOFIL 390 1 0.005 8 Sink EDM( CHARMILLES-Switzerland) PROBOFIL240 1 0.003 9 Numerically controlled wirecutting m/c DK7732(MADE
KR-7660-SP BGA Test Socket Housing OEM Custom Precision CNC Machined Metal Fabrication Service 3/4/5 Axis
1 tem Description Mode QTY Accuracy(mm) 1 Sink EDM M3OF(TAIWAN) 1 0.005~0.01 2 Sink EDM (Mitsubish) EA8M/EA8A 2 0.005 3 Sink EDM FORM S350 3 0.005 4 Sink EDM( CHARMILLES-Switzerland) PROBOFORM 35P 1 0.005 5 Sink EDM( CHARMILLES-Switzerland) PROBOFORM 350 SP 2 0.005 6 Sink EDM ( CHARMILLES-Agie ) FO 23 UP 1 0.005 7 Sink EDM( CHARMILLES-Switzerland) ROBOFIL 390 1 0.005 8 Sink EDM( CHARMILLES-Switzerland) PROBOFIL240 1 0.003 9 Numerically controlled wirecutting m/c DK7732(MADE
Loranger 006004006J6617 Test Socket 6 I/O and 0.23/0.22mm Pitch BGA/CSP Socket Life Cycle 000 cycles
0.22 mm Pitch and Greater Accommodates Package Height Variations Non-Magnetic Socket Options Available Accurate, Tightly-controlled Package Fit Contacts Connect Solder ball to Board Pad Optional Heat Sink Item # Item Name Package Name Number of Input/Output (I/O) Pitch 006004006J6617 6 Input/Output (I/O) and 0.23/0.22 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket BGA/CSP 6 Multi 0.22 mm 0.23 mm 007SQ 004J6617 4 Input/Output (I/O) and 0.40
Custom CNC Parts for High-Speed IC Test Socket Black BGA Test Socket Housing KR-3545-EKR
Key attributes Industry-specific attributes CNC Machining or Not Cnc Machining Material Capabilities Aluminum, Brass, Bronze, Copper, Hardened Metals, Precious Metals, Stainless Steel, Steel Alloys Other attributes Place of Origin Guangdong, China Type Broaching, DRILLING, Etching / Chemical Machining, Laser Machining, Milling, Other Machining Services, Turning, Wire EDM, Rapid Prototyping Micro Machining or Not Micro Machining Materials Avaliable Aluminum Stainless Plastic