"high frequency test socket housing"

Customizable BGA Test Socket Housing Machining Center Probe Test Socket for High-Frequency Devices

High-Frequency Center Probe Test Socket for Devices up to 27mm Square FEATURES Aries unique universal socketing system allows the socket to be easily configured for any package, on any pitch (or multiple pitch) from 0.2mm or greater, in any configuration, with little or no tooling charge or extra lead-time. For Test & Burn-In of CSP, BGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LGA, LCC, PLCC, TO and any SMT package style made. Also can be compatible

High Frequency BGA Test Socket Shell with Pogo Pin Support 35MM X 26MM BGA Test Socket Housing KR-3751-DK

1 tem Description Mode QTY Accuracy(mm) 1 Sink EDM M3OF(TAIWAN) 1 0.005~0.01 2 Sink EDM (Mitsubish) EA8M/EA8A 2 0.005 3 Sink EDM FORM S350 3 0.005 4 Sink EDM( CHARMILLES-Switzerland) PROBOFORM 35P 1 0.005 5 Sink EDM( CHARMILLES-Switzerland) PROBOFORM 350 SP 2 0.005 6 Sink EDM ( CHARMILLES-Agie ) FO 23 UP 1 0.005 7 Sink EDM( CHARMILLES-Switzerland) ROBOFIL 390 1 0.005 8 Sink EDM( CHARMILLES-Switzerland) PROBOFIL240 1 0.003 9 Numerically controlled wirecutting m/c DK7732(MADE