"80mm ball grid array socket"

80 X 90MM BGA Test Socket Housing KR-8090-SP Ball Grid Array Socket OEM Parts CNC Machining Services

BGA TEST SOCKET HOUSING KR-8090-SP Material: Aluminum Alloy Surface Treatment: Anodizing Color: customized Tolerance: 0.03mm Support and Services: Our Product Technical Support team is dedicated to assisting you with any questions or issues you may have regarding the BGA TEST SOCKET HOUSING. We provide expert technical guidance to ensure you get the most out of your product. In addition, our services include product installation support, troubleshooting assistance, and

Customizable BGA Test Socket Housing Machining Center Probe Test Socket for High-Frequency Devices

High-Frequency Center Probe Test Socket for Devices up to 27mm Square FEATURES Aries unique universal socketing system allows the socket to be easily configured for any package, on any pitch (or multiple pitch) from 0.2mm or greater, in any configuration, with little or no tooling charge or extra lead-time. For Test & Burn-In of CSP, BGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LGA, LCC, PLCC, TO and any SMT package style made. Also can be compatible