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Customizable BGA Test Socket Housing Machining Center Probe Test Socket for High-Frequency Devices

CNC Machining
April 01, 2025
Category Connection: CNC Machining
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Tags:
#test socket housing #BGA test socket #High Frequency Test Socket Housing
Brief: Discover the Customizable BGA Test Socket Housing Machining Center Probe Test Socket, designed for high-frequency devices up to 27mm square. This versatile socket offers quick probe replacement, pressure mounting, and compatibility with various package styles, ensuring efficient test and burn-in processes.
Related Product Features:
  • Universal socketing system for any package, pitch, or configuration with minimal tooling charge.
  • Compatible with CSP, µBGA, QFN, QFP, and other SMT package styles, including PGA devices.
  • Quick and easy probe replacement system for fast maintenance and repair.
  • Pressure mounting eliminates the need for soldering, simplifying installation.
  • 4-point crown design ensures optimal scrub on solder balls and pads.
  • Ultra-short signal path of 0.077 inches for high-frequency performance.
  • Compact socket size maximizes the number of sockets per BIB and oven space.
  • Durable materials and high-performance specs, including 10.1GHz bandwidth and 500,000-cycle contact life.
Faqs:
  • What package sizes and types are compatible with this test socket?
    The socket is compatible with any package up to 27mm square, including CSP, µBGA, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LGA, LCC, PLCC, TO, and PGA devices.
  • How does the probe replacement system work?
    The complete set of probes can be quickly removed and replaced with a new interposer. The old set can be returned to the factory for repair and typically returned within one day.
  • What are the operating temperature limits for this socket?
    The socket operates within a temperature range of -55°C [-67°F] to 150°C [302°F], making it suitable for various testing environments.
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